The Lamination Operator Trainee is responsible for processing printed circuit boards (PCB) panels thru various lamination processes according to the travelers or as directed by Supervisors/Managers while following department standard operating procedures.
· Ability to operate OEM hot press
· Ability to load and unload OEM hot and cold press
· Know how to layup Multilayers jobs
· Know how to layup Bland Vias
· After cold press breakdown and check the overall thickness
· Barcode to next departments
· Other duties as assigned
To perform this job successfully, an individual must be able to perform each essential duty satisfactorily. The requirements listed below are representative of the knowledge, skills, and/or abilities required.
· High School Diploma preferred
· Some experience in the Printed Circuit Board industry
· Ability to read and understand technical work instruction
· Must have hands-on experience and knowledge in the prepreg, able to identify differences in core thickness, material, copper weight, press pad, paco via, toddler, lay up plates, separate plates
